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Koh young Equipment for sale

aSPire

*Spare parts donor* 3D solder paste inspection machine Metrology Capability: Volume Area, Height, Offset, Bridging, and Shape Deformation Type of defects: Insufficient/Excessive/Lack of Paste, Bridging, Shape Deformation, and Paste Offset Measuring principle: 3D shadow-free moiré Camera: 4MPix 220V, 1phase, 50-60Hz, 5A, 2.2kW, weight 600 kg, Machine dimensions: 1000 x 1230 x 2097 mm Maximum board size: 510 x 510 mm Min. PCB size: 50 x 50 mm Circuit Board Thickness: 0.4 - 5.0mm max. PCB weight 2kg, 2008

SPI
#42102

aSPire

*Spare parts donor* 3D Solder Paste Inspection Machine Metrology Capability: Volumen Area, Height, Offset, Bridging and Shape Deformity Type of Defects: Insufficient/Excessive/Missing Paste, Bridging, Shape Deformity and Paste offset Measurement Principle: 3D Shadow free Moiré Camera: 4MPix 220V, 1Phase, 50-60hz, 5A, 2,2kW, weight 600kg, Machinedimensions:1000 x 1230 x 2097mm Max PCB size: 510 x 110mm Min PCB size: 50 x 50mm PCB Thickness: 0,4 - 5,0mm Max. PCB weight 2kg, 2011

SPI
#41481

KY3020T

Table Top 3D SPI Metrology Capability: Volumen Area, Height, Offset, Bridging and Shape Deformity Type of Defects: Insufficient/Excessive/Missing Paste, Bridging, Shape Deformity and Paste offset Measurement Principle: 3D Shadow free Moiré Camera: 1MPix 220V, 1Phase, 50-60hz, 0,8A, 0,88kW, weight 95kg, Machinedimensions:780 x 1100 x 734mm Max PCB size: 460 x 410mm Min PCB size: 50 x 50mm PCB Thickness: 0,4 - 4,0mm Max. PCB weight 2kg, 2014

SPI
#41103

KY3020T

Table Top 3D SPI Metrology Capability: Volumen Area, Height, Offset, Bridging and Shape Deformity Type of Defects: Insufficient/Excessive/Missing Paste, Bridging, Shape Deformity and Paste offset Measurement Principle: 3D Shadow free Moiré Camera: 1MPix 220V, 1Phase, 50-60hz, 0,8A, 0,88kW, weight 95kg, Machinedimensions:780 x 1100 x 734mm Max PCB size: 460 x 410mm Min PCB size: 50 x 50mm PCB Thickness: 0,4 - 4,0mm Max. PCB weight 2kg, 2011

SPI
#41102