Search Equipment
*Spare parts donor*
3D solder paste inspection machine
Metrology Capability: Volume Area, Height, Offset, Bridging, and Shape Deformation
Type of defects: Insufficient/Excessive/Lack of Paste, Bridging, Shape Deformation, and Paste Offset
Measuring principle: 3D shadow-free moiré
Camera: 4MPix
220V, 1phase, 50-60Hz, 5A, 2.2kW, weight 600 kg,
Machine dimensions: 1000 x 1230 x 2097 mm
Maximum board size: 510 x 510 mm
Min. PCB size: 50 x 50 mm
Circuit Board Thickness: 0.4 - 5.0mm
max. PCB weight 2kg, 2008
SPI
#42102
*Spare parts donor*
3D Solder Paste Inspection Machine
Metrology Capability: Volumen Area, Height, Offset, Bridging and Shape Deformity
Type of Defects: Insufficient/Excessive/Missing Paste, Bridging, Shape Deformity and Paste offset
Measurement Principle: 3D Shadow free Moiré
Camera: 4MPix
220V, 1Phase, 50-60hz, 5A, 2,2kW, weight 600kg,
Machinedimensions:1000 x 1230 x 2097mm
Max PCB size: 510 x 110mm
Min PCB size: 50 x 50mm
PCB Thickness: 0,4 - 5,0mm
Max. PCB weight 2kg, 2011
SPI
#41481
Table Top 3D SPI
Metrology Capability: Volumen Area, Height, Offset, Bridging and Shape Deformity
Type of Defects: Insufficient/Excessive/Missing Paste, Bridging, Shape Deformity and Paste offset
Measurement Principle: 3D Shadow free Moiré
Camera: 1MPix
220V, 1Phase, 50-60hz, 0,8A, 0,88kW, weight 95kg,
Machinedimensions:780 x 1100 x 734mm
Max PCB size: 460 x 410mm
Min PCB size: 50 x 50mm
PCB Thickness: 0,4 - 4,0mm
Max. PCB weight 2kg, 2014
SPI
#41103
Table Top 3D SPI
Metrology Capability: Volumen Area, Height, Offset, Bridging and Shape Deformity
Type of Defects: Insufficient/Excessive/Missing Paste, Bridging, Shape Deformity and Paste offset
Measurement Principle: 3D Shadow free Moiré
Camera: 1MPix
220V, 1Phase, 50-60hz, 0,8A, 0,88kW, weight 95kg,
Machinedimensions:780 x 1100 x 734mm
Max PCB size: 460 x 410mm
Min PCB size: 50 x 50mm
PCB Thickness: 0,4 - 4,0mm
Max. PCB weight 2kg, 2011
SPI
#41102