Koh young

aSPire

*Spare parts donor*
3D Solder Paste Inspection Machine
Metrology Capability: Volumen Area, Height, Offset, Bridging and Shape Deformity
Type of Defects: Insufficient/Excessive/Missing Paste, Bridging, Shape Deformity and Paste offset
Measurement Principle: 3D Shadow free Moiré
Camera: 4MPix
220V, 1Phase, 50-60hz, 5A, 2,2kW, weight 600kg,
Machinedimensions:1000 x 1230 x 2097mm
Max PCB size: 510 x 110mm
Min PCB size: 50 x 50mm
PCB Thickness: 0,4 - 5,0mm
Max. PCB weight 2kg