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Cyberoptics Equipment for sale

SE 300 Ultra

3D solder paste inspection system CyberOptics SW: version 2.1.50.0 lang. EN Panel size capacity: Maximum 508 x 508 mm (20 x 20 in.) Minimum 101 x 40 mm (4 x 1.5 in.) Maximum Panel Weight 3 kg (6.6 lb.) Board Thickness 0.5 to 5 mm (0.02 to 0.2 in.), 2008

AOI
#37741

SE 300 Ultra

3D solder paste inspection system CyberOptics SW: version 2.1.50.0 lang. EN Panel size capacity Maximum 508 x 508 mm (20 x 20 in.) Minimum 101 x 40 mm (4 x 1.5 in.) Maximum Panel Weight 3 kg (6.6 lb.) Board Thickness 0.5 to 5 mm (0.02 to 0.2 in.), 2007

AOI
#37740

SE500

3D SPI Solder paste inspection Inspection speed 80cm2/sec (12,3in.2/sec) Panel width 50 - 510mm Panel length 50 - 510mm, 2010

AOI
#36928

QX500-L

2D AOI Inspection speed 200cm2/sec (31in.2/sec) Panel width 50 - 510mm Panel length 50 - 510mm Resolution 17µm pixel, 2012

AOI
#36927

QX500

2D AOI upgraded to QX600 Inspection speed 200cm2/sec (31in.2/sec) Panel width 50 - 308mm Panel length 50 - 457mm Resolution 17µm pixel, 2010

AOI
#36926