Samsung

SM482

Pick and Place
Alignment flying vision and stage vision
6 spindles on 1 gantry
Placement speed 28,000 CPH optimum
Placement accuracy chip ±50 µm at µ+3σ
Placement accuracy QFP ±30 µm at µ+3σ
Component range 0603 0201 inch to □55 mm
Flying vision FOV 25 standard, 0603 0201 inch to □22 mm IC
Flying vision FOV 25 connector lead pitch 0.5 mm
Flying vision FOV 25 BGA and CSP to □17 mm, ball pitch 0.75 mm
Stage vision FOV 45 standard, to □42 mm IC
Stage vision FOV 45 connector lead pitch 0.4 mm
Stage vision FOV 45 BGA and CSP ball pitch 1.0 mm
Stage vision FOV 45 to □55 mm MFOV, connector to □75 mm
Maximum component height 15 mm
PCB size min. 50 x 40 mm
PCB size max. 460 x 400 mm
PCB thickness 0.38 to 4.2 mm
120 feeder slots
Polygon recognition
Vacuum pump
Automatic pick up position alignment
Machine dimensions 1,650 x 1,680 x 1,530 mm
Weight approx. 1,600 kg

Equipments:
39xFeeder SM8MM4P IT
10x Feeder SME8MM IT
23x Feeder SM12MM IT
12x Feeder SM16MM IT
8x Feeder SM24MM IT
4x Feeder SM32MM IT
2x Feeder SM44MM IT
+Racks
+Feeders spare parts