Omron

VT-S530

Automatic inspection system - 3D AOI
3D solder joint inspection
3D reconstruction through color highlight and phase shift technology
12M pixel camera
PCB size min. 50 x 50 mm
PCB size max. dual lane 510 x 330 mm
PCB size max. single lane 510 x 680 mm
PCB thickness 0.4 to 4 mm
Clearance above 50 mm
Clearance below 50 mm
Height measurement range 25 mm
Inspection item component height, lift, tilt, missing and wrong component
Inspection item wrong polarity, flipped component, component offset X Y rotation
Inspection item OCR, 2D code
Inspection item fillet height, length, end joint width, wetting angle, side joint length
Inspection item exposed land, foreign material, land error
Inspection item lead offset, lead posture, lead presence
Inspection item solder ball, solder bridge
Line height 900 ±20 mm
Machine dimensions 1180 x 1640 x 1500 mm
Weight approx. 850 kg