Search Equipment
In the BF-3Si, the proven PMP technology used to capture the height profile is supplemented with 2D information. This means that the system has access not only to the height and position of each pixel, but also to colour and grey-scale values.
This additional information expands the inspection capabilities and supports 3D reconstruction.
Horizontal resolution: 18 μm
Vertical resolution: 0.33 μm
PCB size: 50x60mm – 460x510mm
PCB thickness: 0.6mm – 3.2mm
LP clearance top/bottom: 40 mm/40 mm
Camera system: CMOS area camera
FOV size: 36 x 36 mm
Illumination: 2-way projection with multi-angle rings
Inspection speed: 33.75 cm²/sec.
Operating system: Windows 7
Dimensions (machine WxDxH): 1040 x 1440 x 1470 mm
Weight: approx. 870 kg
Machine#: 46323
Category: SPI
Year: 2016/02
Customer owned
For Sale




