Rehm

CondenxoXP Vac

Vapor phase reflow soldering system with vacuum function
Soldering under condensation principle
Vacuum chamber for minimization of air inclusions and voids
Special cooling manifold for optimized cooling performance
Offline system with optional inline operation via additional conveyor
PC renewed, pumps replaced
Chamber refurbished in 2024
Closed-loop process gas circuit with filter unit
Integrated preheating and controlled cooling section
Wireless profiling system integrated
Spare parts and documentation available
Cooling unit to be provided by customer
Nitrogen atmosphere
Touchscreen control interface with process visualization
SMEMA interface
Transport direction L->R