Mühlbauer

DS Variation ECO

Mühlbauer DS Variation ecoLINE
Flexible die sorting system with 6-side AOI and IR sidewall inspection

Input:

12’’ Wafer
JEDEC Tray (with Adapter)

Output:

12’’ Wafer
6’’ + 8’’ Wafer (with Adapter)
JEDEC Tray (with Adapter)

Mapping:
Map-Host-PC with Wafer-Mapping-Software
Integrated Barcode Readers

Die Handling:
Single Bond Head
Direct Pick & Place
Flip Chip with Integrated Endurance-Flip Unit

Place Accuracy:

Die-on-fly: ±30 μm
Die-on-tool: ±20 μm
Rotation: ±1.5°

Die Size:

Min.: 0.25 x 0.25 mm
Max. (Flip): 20.0 x 20.0 mm
Max. (Non-Flip): 25.0 x 25.0 mm

Machine Dimensions:

L x D x H: \~2550 x \~1950 x \~2000 mm
Weight: \~2300 kg

AOI (Automated Optical Inspection):

Die front side:

Die position using pattern matching or edge detection
Surface inspection
Die back side:

Die position using edge detection
Surface inspection
Sidewall inspection
Pre- & Post-Place inspection