Koh young

Aspire 2

3D solder paste measurement using Shadow Free Moire with 4-axis projection
Measurement Range: Volume, Area, Height, Offset, Bridging, Shape Deformity
Detectable Defects: Missing Paste, Excessive Paste, Insufficient Paste, Bridging, Shape Deformity, Paste Offset
Measurement Accuracy: Less than or equal to 10 percent Gage R and R on 01005 pads
PCB Size: Minimum 50 x 50 mm, Maximum 510 x 510 mm
PCB Thickness: 0.4 mm to 5.0 mm
Maximum PCB Weight: 2.0 kg
Bottom Clearance: 30 mm
Camera: 4 Megapixel
Z-axis Resolution: 0.37 micrometers