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AdoptSMT Equipment Detail

ASM

AB559

Wire Bonder
Bonding method: Wedge
rotary bond head
Wire diameter: 20–50 μm
Bond force: 15–175 g (programmable)
Bonding area (XY): 208 × 106 mm
Bond angle: 60°

Machine#: 45593

Category: Bonders

Year: 2012/10

Customer owned

For Sale

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