Saki

BF-3Di-L1

3D Automated Optical inspection machine
Horizontal resolution 18µm
Vertical resolution 1µm
Repeatability 2µm (3σ) or better
PCB size 50 x 60 - 460 x 510mm
PCB thickness 0.6 to 5.2mm (including PCB warp)
PCB warp +/- 2mm
PCB clearance Top 40mm Bottom 40mm
Rotation support 0 to 359° (increments of 1°)
Inspection categories Presence Absence Misalignment Tombstone Inverted Polarity Bridge Absence of solder Insufficient solder Lifted lead Lifted chip Fillet defect
Camera CMOS area camera
Lighting Quad projection system with multi-directional infrared light
FOV size 36 x 36mm
Image capture time 390 ms/FOV
Load/unload time approx. 5 seconds
Conveyor method Flat belt transfer
Conveyor height 880 to 965mm
Width adjustment Automatic