Viscom

S 3088 ultra

High-speed solder joint inspection with a resolution of up to 8 μm
Precise 3D analyses with high-performance sensor technology
Unique analysis of QFN, DFN, and QFP dewetting using angled views
Inspection speed up to 50 cm²/s
Angle views with 4 cameras, 8 cameras optional
Z-resolution of 0.5 μm and lateral resolution of 16 μm
User-friendly software Viscom vVision/EasyPro
Fast PCB handling with Viscom FastFlow, change in up to 2 seconds
Integrated verification feature to ensure zero defect escape strategy