Koh young

aSPire

*Spare parts donor*
3D solder paste inspection machine
Metrology Capability: Volume Area, Height, Offset, Bridging, and Shape Deformation
Type of defects: Insufficient/Excessive/Lack of Paste, Bridging, Shape Deformation, and Paste Offset
Measuring principle: 3D shadow-free moiré
Camera: 4MPix
220V, 1phase, 50-60Hz, 5A, 2.2kW, weight 600 kg,
Machine dimensions: 1000 x 1230 x 2097 mm
Maximum board size: 510 x 510 mm
Min. PCB size: 50 x 50 mm
Circuit Board Thickness: 0.4 - 5.0mm
max. PCB weight 2kg