Koh young

KY3020T

Table Top 3D SPI
Metrology Capability: Volumen Area, Height, Offset, Bridging and Shape Deformity
Type of Defects: Insufficient/Excessive/Missing Paste, Bridging, Shape Deformity and Paste offset
Measurement Principle: 3D Shadow free Moiré
Camera: 1MPix
220V, 1Phase, 50-60hz, 0,8A, 0,88kW, weight 95kg,
Machinedimensions:780 x 1100 x 734mm
Max PCB size: 460 x 410mm
Min PCB size: 50 x 50mm
PCB Thickness: 0,4 - 4,0mm
Max. PCB weight 2kg