Parmi

SPI HS 60

Solder Paste Inspection System
Camera System: High frame rate C-Mos Sensor,18x18µm pixel resolution
Scan Resolution 20µm, Lateral Resolution 18µm, height Resolution 0,2µm
max. Paste height: 1000µm, max Paste size 20x20mm
min. Paste size 200 x 200µm, min. Paste pitch 150µm
Interface Smema
Min. Board size 50 x 50mm
Max. Board size 390 x 260mm
Max. board weight 1kg
Board Thickes 0,4-4mm
1 Conveyort stage
L->R