SPI HS 60

Solder Paste Inspection System Camera System: High frame rate C-Mos Sensor,18x18µm pixel resolution Scan Resolution 20µm, Lateral Resolution 18µm, height Resolution 0,2µm max. Paste height: 1000µm, max Paste size 20x20mm min. Paste size 200 x 200µm, min. Paste pitch 150µm Interface Smema Min. Board size 50 x 50mm Max. Board size 390 x 260mm Max. board weight 1kg Board Thickes 0,4-4mm 1 Conveyort stage L->R, 2008

SPI
#40946